Layer 1 · How the heat leaves
Direct-to-chip liquid cooling
Anyone deploying GB200-class hardware. NVIDIA has confirmed liquid cooling is a mandatory architectural requirement for GB200 NVL72, not a preference.
The shape of it
- Capital cost
- Higher than air; lower than immersion
- Maturity
- proven
- Density supported
- 50-200+ kW per rack
- PUE
- 1.1-1.2
Verified 2026-09-06.
The catch
Cold plates capture most of the heat; the rest still leaves as air, so you keep a hybrid air path. It is not a full replacement for the existing system.
What it actually decides
The 2026 production method, full stop. It holds 47% of the AI datacentre liquid cooling market on the strength of standard rack compatibility and a straightforward retrofit path.
What this is powering
A GB200 NVL72 rack draws 120–132 kW and a GB300 pushes 135–200 kW, against a 2026 average rack of about 27 kW. The silicon decision and the power decision are the same decision, made eighteen months apart.
Layer 2 — Silicon · GB200 NVL72 · The 150 W inference option
Weighed against
- Direct-to-chip liquid cooling vs Single-phase immersion — The production method against the thermally superior one. Serviceability decides it, not physics.
- Air cooling vs Direct-to-chip liquid cooling — Where the crossover actually sits: about 30 kW a rack on cost, 45-50 kW on thermals.
Others in how the heat leaves
- Air cooling — Up to ~30 kW per rack
- Rear-door heat exchangers — ~30-50 kW per rack
- Single-phase immersion — 100+ kW per rack equivalent
- Two-phase immersion — Highest available
- Free and evaporative cooling — Depends on the paired system